DCON26_SLIDES_Track03_Panel朇POvs.OIOEvolutionorRevolutioninOptical_149_223.pdf

1、CPO vs.OIO:Evolution or Revolution in Optical Interconnects?DesignCon 2026February 24,2026 2026 Synopsys,Inc.2Evolution of Interconnect TechnologiesSynopsys Confidential Informationhttps:/ 2026 Synopsys,Inc.3PanelistsSynopsys Confidential InformationSanjay GangadharaSenior DirectorSynopsysAttila Mek

2、isDistinguished EngineerCiscoNhat NguyenSenior DirectorAyar LabsRebecca SchaevitzCo-Founder and CPO*Mixxtech*Chief Product Officer,not Co-Packaged Optics!Brad TurcottSenior DirectorLightmatter 2026 Synopsys,Inc.4Synopsys Confidential InformationCPO vs.OIO:Evolution or Revolution in Optical Interconn

3、ects?Brad Turcott,Senior Director,Solution Architecture&Field Application Engineering Feb 24,2026Copyright 2026,Lightmatter,Inc.All rights reserved.6PHOTONIC CHIPS FOR AIGEN 1Pluggables17-20pJ/bit1xSpeedupGEN 2NPO/OBO6pJ/bit4xSpeedupGEN 32D CPO4pJ/bit10 xSpeedupGEN 43D CPO/Interposer2pJ/bit100 xSpee

4、dupOptical EngineXPU/SwitchChip Package2025-26202720282029+From NPO to 3D Interposers,Lightmatter has the 10 year roadmap for photonics in validation racks today.PCBOptical Interconnect Evolution 7PHOTONIC CHIPS FOR AIHigh YieldMeet Product PerformanceHigh Throughput(UPH,units per hr)Known Good OESc

5、alable across package architecturesServiceability V-Groove with fixed FAUWafer Level Optical coupler(GC or cavity based)Platform&process innovation and strong ecosystem partnerships requiredProduction,Packaging&Serviceability Challenges Key Performance Indicators for HVM fiberCPO and In-Package Opti

6、csNhat NguyenSr.Director of ArchitectureFebruary 24,2026 Ayar Labs,Inc.All rights reservedConfidential&Proprietary9Evolution of Co-Packaged Optics(CPO)2021 OIF 6.4T module(Tx+Rx)SerDes for XPU to moduleDR or FR4 optical interfaceOrganic substrate2026 Nvidia Sp