DC25_PAPER_Track01_FastDesignAndSimulation_Dai.pdf

1、 Fast Design and Simulation of Photonics Computing Chip Base on Chiplet-based Heterogeneous Integration Wenliang Dai,Xpeedic Co.,LTD Mingyang Jiang,Lightstandard(Suzhou)Co.,LTD.jiangmingyanglightstandard.co Xuanjiang Shen,Lightstandard(Suzhou)Co.,LTD.shenxuanjianglightstandard.co Abstract Photonic c

2、omputing technology based on large-scale matrices has been shown to surpass Moores Low and meet the increasing demand for high computing power,energy efficiency,and the ability to solve complex tasks.However,photonic computing also presents significant challenges in package design and simulation due

3、 to its complex heterogeneous integration of silicon photonic chips and electronic components.In this paper,we propose a rapid design and simulation method for photonic computing chips based on the heterogeneous integration of chiplets.Various digital-to-analog(DAC)chips for electro-optic modulators

4、(EOM)and weights,as well as analog-to-digital converter(ADC)chips for photodetectors(PD)and photonic computing chips on silicon interposers,offer enhanced higher bandwidth and reduced latency,while accommodating a large number of input/output(I/O)connections and micron-scale structures.To sustain su

5、ch high density and bandwidth,we investigate and compare several routing strategies using a new fast signal integrity analysis method,which includes both pre-sim and post-sim evaluations.Additionally,we optimize mesh ground parameters,which involve constructing accurate channel models through templa

6、tes and GDS files,and performing rapid analyses in both frequency and time domains using the Input/Output Buffer Information Specification(IBIS)model.This comprehensive approach ultimately enables automatic full signal coverage.Author(s)Biography Wenliang Dai,Co-Founder,VP of Xpeedic.Received the M.