DC25_PAPER_Track04_UseOfThinFilmResistors_Andresakis_V2.pdf

1、Information Classification:GeneralUse of Thin Film Resistors in Organic Substrates for Modules&Chip PackagingAndreas Schilloff,Greensource F John Andresakis,Quantic Ohmega TMark Chasse,Greensource Fabrication Information Classification:GeneralAbstractIntegrating thin film resistors into organic subs

2、trates for module and integrated circuit(IC)packaging presents a transformative approach to electronics design.This methodology offers many benefits,primarily from miniaturization and optimization of circuit components.By embedding thin film resistors directly within the organic substrate layers,the

3、 need for discrete resistors is significantly reduced,thereby conserving valuable surface area on the substrate.The manufacturing process of embedding thin film resistors requires a novel new resistive material.However,it utilizes traditional processing techniques,ensuring seamless integration into

4、existing production lines without requiring specialized equipment or significant alterations to standard procedures.This compatibility with conventional fabrication methods ensures that the transition to this innovative design can be adopted with minimal disruption to current manufacturing workflows

5、,making it a practical and feasible solution for the industry.Author(s)BiographyAndreas SchilloffAndreas Schilloff joined GreenSource fabrication in 2018,bringing along many years of PCB fabrication experience from both I3 Electronics and Sanmina Corporation.In addition,Andreas has an ME/EE degree f

6、rom RIT.From 2018 through the present time as Principal Product Engineer,he has contributed to expanding GSF capabilities in producing third-party product,from the aspects of NPI/Process/Product engineering.John Andresakis has over 40 years of experience manufacturing printed circuit boards and rela