DC25_SLIDES_Track01_FastDesignAndSimulationOf_Dai_V2.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralFast Design and Simulation of Photonic Computing Chip with Chiplet-based Heterogeneous IntegrationMingyang Jiang(Lightstandard),Xuanjiang Shen(

2、Lightstandard)2Wenliang Dai(Xpeedic)Information Classification:GeneralSPEAKERSWenliang DaiPresident,XWenliang Dai is Co-Founder,President of Xpeedic.He received the M.S.degreein electromagnetic fields and microwave technology from University Of ElectronicScienceAndTechnologyOfChina(UESTC)andthePh.D.

3、degreeinelectromagnetic fields and microwave technology from Shanghai Jiao TongUniversity(SJTU),Shanghai,China,in 2001 and 2004,respectively.Dr.Dai is aConsultant of MIIT National IT talent development project.He was a SeniorMember of Consulting Staff at Cadence Shanghai R&D Center.He was a regularr

4、eviewer for international journals and conferences including IEEE TMTT,IEEETAP,DAC,etc.3Information Classification:GeneralOutline4 Background Introduction of Photonic Computing Chip:Principle of Photonic Computing ChipPhotonic Computing Chip Structure Design of Photonic Computing Chip Based on 2.5D

5、Silicon Interposer:High Performance Design ProcessLayout and Physical Implementation 2.5D Interposer SI/PI Simulation:Pre/Post SI SimulationDC IR-drop Simulation SummaryInformation Classification:GeneralBackground of Photonic Computing 5Training FLOPS for Transformer models has been growing at a rat

6、e of 750 x/2yrsPhotonicsElectronicsImprovementLatency100ps100ns103Bandwidth20GHz2GHz10Power1uW1mW103Area2500um22500um21Hardware FLOPS,memory,and interconnect bandwidth have been increasing falling behind.Photonic computing has the potential to overcome these challenges.Information Classification:Gen