DC25_PAPER_Track6_DirectToSubstrate200GPAM4_Krooswyk.pdf

1、 Information Classification:General Direct to Substrate 200G-PAM4 Co-Packaged Connectors:Is it a Reality?Steve Krooswyk,Samtec Jignesh Shah,Samtec Evan Beauprez,Broadcom Regee Petaja,Broadcom Information Classification:General Abstract Co-packaged connectors(CPC)and cables can avoid the loss and ref

2、lections from the packageboard interface and increase system reach.But why havent they taken off?Apparent SI advantages are not everything-assembly and process must be refined.Enablers for direct to substrate connectivity are reviewed including package stiffeners,separable interface,solder attachmen

3、t,and aggressive miniaturization.Results include package after reflow,VNA and BER measurements of full channels with CPC.Author(s)Biography Steve is technical lead in Samtecs high speed connector and cable development group.His 20 years of experience includes a role as PCI Express lead in Intels Dat

4、a Center Group,introducing excursion metrics in the PCI-SIG,co-authoring High Speed Digital Design for High Speed Interconnects&Signaling,and an MS from U.of South Carolina.Jignesh Shah is a Technologist in Samtecs High Speed Connectivity group.He has over 25 years of experience in the architecture

5、and design of both copper and optical interconnects.Jignesh has engineering degrees from UT Austin and IIT Bombay.Evan is technical lead in Broadcoms Signal Integrity group within the companys ASIC Product Division.With 19 years of experience,his roles have included high speed SerDes design,system a

6、rchitecture and signal integrity.Evan holds a BS in Computer Engineering from Colorado State University.Regee Petaja is the APD System Signal Integrity Manager at Broadcom.Currently working on 100+Gbps SerDes system design,debug and support.Information Classification:General Introduction The next ge