DC25_SLIDES_Drive_StackingTheDeckMaximizingThe_Beeker.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention CenterExpoJanuary 2930,2025 Page 1Information Classification:GeneralStacking the deck:Maximizing the PCB layer design for best signal integrity and EMC performanceTechnical Session Jan 30,2025,9:00 am-9:4

2、5 am Ballroom HDaniel Beeker,(NXP Semiconductor)Page 2Information Classification:GeneralStacking the deckIn automotive,it is all about reliability and power consumption.In your ECUs,the foundation for this is the PCB.It is usually the largest and most expensive component,and gets the least attention

3、 until something fails.Understanding the components that make up this critical structure is a key to success.Copper foil,prepreg,cores,vias,plating,argh.How do you use these things to make something that achieves the behavior needed for function and compliance?This session will focus on the importan

4、ce of understanding the role of the PCB layers in directing the signal and power supply energy between the board layers.The focus is on knowing which dielectric you are using,and how to move that energy between dielectric layers in the PCB.You know its all about the space!Information Classification:

5、GeneralSPEAKERDaniel BeekerTechnical Director,NXP S|NXP.comWith more than 44 years of experience in electronic system design and EMC,Daniel Beeker provides application support for NXP Automotive customers worldwide.Daniel also supports NXP customers globally with special function development tools a

6、nd instrumentation.Daniel specializes in EMC and signal integrity design techniques for systems and PCBs,especially in low-layer count designs.In support of this,Daniel has completed more than 300 PCB design evaluations for customers and internal NXP products.Daniel teaches field-based design techni