DC25_PAPER_Track13_InnovativeDesignOf224GBGA_Kang.pdf

1、Information Classification:GeneralInnovative Design of 224G BGAPinmap and Via StructureXin Kang,ZTEJinlong Li,ZTEXiuguo Jiang,KGuoying Wei,ZTEZhongmin Wei,ZTEYu Bi,ZTEInformation Classification:GeneralAbstractThis paper proposes an innovative pinmap design that achieves higher bandwidth andlower cro

2、sstalk,as well as a via structure design that allows flexible adjustment of viaimpedance.Firstly,crosstalk analysis is conducted on various via placement schemes within the BGAfootprint.Through innovative designs including adjusting the via fan-out and padarrangement,bandwidth improvement and crosst

3、alk reduction can be achievedsimultaneously.Taking package size and signal bandwidth into consideration.Secondly,to further optimize the impedance continuity of the via,an innovative viastructure is proposed.This structure can flexibly adjust the impedance of PCB via,thereby improving system impedan

4、ce continuity.Finally,applying this BGA pinmap design to a 224Gbps system,constructing a ball-to-ball link with a loss of 28dB.The system achieved approximately 90%reduction incrosstalk ICN and a 17%increase in COM,which is validated by measurements.Author(s)BiographyXin Kang joined ZTE Corporation

5、in 2020 as a Signal Integrity Engineer.Shespecializes in the modeling,simulation,and measurement of high-speed links.Herresearch focuses on enhancing the de-embedding bandwidth of SMA,optimizing via fan-out and impedance,and simulating SerDes signals.She obtained her Masters degree inIntegrated Circ

6、uit Engineering Design from Xian University of Posts andTelecommunications in 2020.Jinlong Li,SI engineer in ZTE since 2014.He was responsible for Optimizing the SIperformance of the BGA array and the transmission line in the PCB in ZTEs high-speedsignal analysis team,researching for new technologie