DC25_SLIDES_Track04_HighSpeedAndHighDensity_Shen_V3.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralHigh Speed and High-Density Interconnect Using PTFE Material for Flexible PCB Ribbon CablesSpeaker Scarlet Wang,(Shengyi Technology)Paper Auth

2、or Dayong Shen,(Bytedance Co.,Ltd.)Songgang Chai,(Shengyi Technology)Wei Huang,(Shengyi Electronics)Gelu,(Ruijie Networks)2Information Classification:GeneralSPEAKERSScarlet WangProduct Technical Director,SYTECHScarlet has 19 years laminate industry technical support experience in Shengyi Technology.

3、Shes dedicated in HSD,RF,automotive and power supply laminate materials.3Songgang ChaiNew products development engineer,SYTECH Chai is R&D engineer,worked over 17 years at Shengyi Technology,focuses on high frequency materials new technologies developing.Information Classification:GeneralSPEAKERSJer

4、ry HuangProduct Technical Director,SYEWJerry has 27 years PCB industry technical support experience in Shengyi Electronics.Hes specializing in PCB process technologies and solutions forcommunication,network,servers.4Information Classification:General Background Low Loss FCCL by PTFE oModified PTFE c

5、haracteristic with filleroFCCL w/o glass PTFE Manufacture processoTroubles in PTFE processoSimplify process by stack-up design 224G“Flyover”C2M with flex cable oFlex cable structureoSI verification resultOutline5Information Classification:General PCB only oHigh density,max PCB routing is 13inch in 1

6、12/224GoCross board is an issue,very difficult in 224G“Flyover”copper cableoVery low loss and long interconnect distanceoLess density and need space to arrange cable FPC would be good supplement oFPC needs to be low lossoIn scenario of high density and short connect distance,such as 512 lane switchC