DC25_SLIDES_Track13_CascadedPackageToPCBChannel_Peng.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralCascaded Package to PCB Channel Simulation Method Considering Different High-speed 3D Interconnect Models Extended to Higher Bandwidth up to 75

2、 GHz Zhekun Peng,Missouri University of Science and TechnologyChaofeng Li,Missouri University of Science and TechnologyJunyong Park,Missouri University of Science and TechnologySathvika Bandi,Missouri University of Science and TechnologySantosh Pappu,Meta PlatformGranthana Rangaswamy,Meta PlatformXu

3、 Wang,Meta PlatformSrinivas Venkataraman,Meta PlatformDongHyun(Bill)Kim,Missouri University of Science and Technology2Information Classification:GeneralSPEAKERSZhekun PengPh.D.in Missouri University of Science and Technology,EMC lab pengzhemst.eduZhekun Peng received the B.S.degree in electronic and

4、 information engineering fromHuazhong University of Science and Technology,Wuhan,China in 2019.He is currentlyworking toward the Ph.D.degree in electrical engineering at EMC Laboratory,MissouriUniversity of Science and Technology.His research interests include corona discharge on glass,on-chip ESD,S

5、erDes high-speed channel analysis,through-silicon via technology and EMI measurement.He worked as an EMC Design Engineering Intern at Apple Inc.in 2023.Mr.Peng wasthe recipient of DesignCon 2021 Early Career Best Paper Award and 2024 IEEE JointEMC Japan/APEMC Risaburo Sato Award(Best Paper Award).Mr

6、.Peng was therecipient of 2024 EMC Society Presidents Memorial Award.3Information Classification:GeneralIntroduction Package-PCB Channel Simulation4Complexity of simulating end-to-end package and PCB channel performance.Long 3D finite element method(FEM)simulation time.Complexity of simulation:Large