F1 - Efficient Chiplets and Die-to-Die Communications.pdf

1、ISSCC 2024Forum 1Efficient Chiplets and Die-to-Die Communications 2024 IEEE International Solid-State Circuits ConferenceISSCC 2024 Forum 1:Efficient Chiplets and Die-to-Die CommunicationsFebruary 18th,2024Presentation start at 8:15amISSCC 2024-Forum 11 of 4 2024 IEEE International Solid-State Circu

2、its ConferenceOrganizing CommitteeOrganizers:Shidhartha(Sid)Das,AMD,Cambridge,United KingdomJohn Wuu,AMD,Fort Collins,ColoradoCo-Organizers:Yvain Thonnart,CEA-List,Grenoble,FranceHugh Mair,MediaTek,Austin,TexasChampionsFatih Hamzaoglu,Intel,Hillsboro,OregonKostas Doris,NXP,Eindhoven,The NetherlandsI

3、SSCC 2024-Forum 12 of 4 2024 IEEE International Solid-State Circuits Conference8 talksEach 45-minute talk will be followed by 5 minutes of Q&APlease state your name and affiliation during Q&A2 coffee breaks and one lunch breakDigital copy of all slides will be provided for the forumPlease switch you

4、r mobile devices to silent modePlease remember to complete speaker evaluation formsGeneral Information ISSCC 2024-Forum 13 of 4 2024 IEEE International Solid-State Circuits ConferenceStartTitleSpeakerAffiliation8:15 AMIntroductionJohn WuuAMD8:25 AMAdvanced CMOS and Packaging Technology for Multi-chi

5、plet and Trillion Transistor 3DIC System-in-Package by 2030Yujun LiGeoffrey YeapTSMC9:15 AMThe Packaging and Interconnect Requirements of the IC Industrys Chiplet-based FutureSam NaffzigerAMD10:05 AMBreak10:20 AMDo Chiplets Open the Space for Emerging Memory in the HPC System?Sebastien CouetGouri Sa

6、nkar KarIMEC11:10 AMIn-memory Computing Chiplets for Future AI AcceleratorsEchere IroagaEnCharge AI12:00 AMLunch1:20 PMEfficient Domain-Specific Compute with ChipletsDejan MarkovicUCLA2:10 PMInnovations in Chiplet Interconnects,Protocols and the Path to StandardizationLihong CaoASE US3:00 PMBreak3:1