6392 - A journey to Open Rack V3.pdf

1、Hugo Collignon-HW ArchitectStphane Dutilleul-VP HW EngineeringA journey to Open Rack V3A journey to Open Rack V3Hugo Collignon-HW ArchitectStphane Dutilleul-VP HW EngineeringEMEA DEPLOYMENTSOF OCP RECOGNIZED SOLUTIONSWho is Scaleway?Our needs/objectivesA cloud provider thats 100%European A resilient

2、 product portfolio across 3 regions with multiple AZsA scaling,large and dense installed base to operateOptimizeCAPEX and OPEX better HW cost efficiencyrack level densitypower efficiencycooling efficiencyMany of the OCP projects with due considerationDC-MHS/DC-SCMSome Open FW solutions tooOpenBMCOpe

3、n Rack V3Open Rack V3 Optimized Power and cooling efficiencyOptimized Assembly and serviceabilityImproved Modularity&reusabilityPossible leadsLooking for:Specific socketMultinode can be nice2OU or moreCollaborate with a partner(specs to mass prod)=Our first ORV3 server wasnt existing off the shelfWh

4、en designing our own chassis:easier to do it on ORV3!Chassis/ServersHavent ORV3 switchesMotivation to use power from busbarDont want to add 2 PDU only for switch(es)How to connect them to tap-off(+WHIP cables to powershelf)Proper containment not so trivialSwitches-48 VDC is a telco standardDC PSU op

5、tion available for datacenter switchNo standard DC connectorCheck if PSU are fusedServiceability(PSU/fan swap,access to console)SwitchesFound blanking panels“racked”like servers with IT railsOr on another plan,not aligned with device facesIssue at OU1/OU44No vertical lock on the right planMagnets?No

6、t reliableEPDM?Only with the good one(thickness,adhesion,glue)=It works!Blanking panelsMultiple projects based on ORV3 in the pipeRack level test due in Q2 2025Go To Production expected in Q3/Q4 2025 Consider to make our contributions avail