heterogeneous integration. We expect hypersockets to contribute at least 5-10% of total revenue by end-2026e, acting as a key growth driver for the company. electrical contact under prolonged high-temperature and high-voltage conditions, typically during burn-in processes designed to identify early-life device failures. Material selection and mechanical design emphasize thermal endurance, contact durability, and resistance to oxidation or deformation over extended test cycles. While burn-in sockets generally carry lower unit pricing than high-frequency sockets, demand closely tracks overall volume-driven segment within the testing socket market. We also expect broader customer adoption of burn-in steps in testing flows. NVIDIA and AMD have incorporated burn-in testing across multiple product generations, and we expect MediaTek's Google TPU Zebrafish platform to introduce burn-in testing in 2H26.