DCON26_SLIDES_Track2_ModelingTransmitterwithBoostingCapacitorbasedonPlugged-inBehaviorIBIS_166_139.pdf DCON26_SLIDES_Track13_PortReferencinginS-ParametersCriticalInsightsYouNeedtoKnow_213_115.pdf DCON26_SLIDES_Track13_HowtoDesignPredictableInterconnectsUpto448Gbps_201_192.pdf DCON26_SLIDES_Track12_PracticalSemi-AutomatedApproachforSignalIntegrityTestingofHigh-SpeedHigh-DensityCable_183_180.pdf DCON26_SLIDES_Track14_AI-DrivenThermal-AwareDataCenterCapacityPlanning_102_162.pdf DCON26_SLIDES_Track13_Keynote朏romSpookyActionataDistancetotheQuantumInternet_302_113.pdf DCON26_SLIDES_Track12_UncertaintyLoomsLargeImprovingtheAccuracyofStepLoadTesting_54_126.pdf DCON26_SLIDES_Track13_ViaFan-OutDesignsfor448GbpsSIvsTechnology_109_117.pdf DCON26_SLIDES_Track12_AdaptiveScopeNoiseRemovalAPracticalTrade-OffBetweenMeasurementBiasandVariation_90_120.pdf DCON26_SLIDES_Track12_Tutorial朥nderstandingTestFixtureDe-EmbeddingforAccurateS-ParameterCharacterizationof_291_128.pdf DCON26_SLIDES_Track13_MultimodeResonanceSuppressionPAM4EyeDecompositionfor212.5-GbpsOSFP_88_114.pdf DCON26_SLIDES_Track15_Tutorial-SynergisticAutomotiveControlsofDynamicsEfficiencyforVehicleElectrification_15_88.pdf DCON26_SLIDES_Track13_Near-ChipCopackagedCopperCopackagedOpticsInterconnects_58_165.pdf DCON26_SLIDES_Track13_BreakingtheBandwidthBarrierTestFixturesandMethodologiesfor448GbpsDataTransmission_167_226.pdf DCON26_SLIDES_Track12_PerformanceCriteriaPracticalImplementationofDe-embeddingTestFixturesfor200GbsPerLaneC_189_118.pdf DCON26_SLIDES_Track12_BridgingtheGapBetweenSimulationMeasurementinDDR5TechniquesforImprovedCorrelation_182_123.pdf DCON26_SLIDES_Track12_Connector-FreeTerminationforFEXTMeasurementsUsingAbsorbersonBGAPads_233_125.pdf DCON26_SLIDES_Track11_TargetedEMIMitigationUsingEmissionSourceImaging3D-PrintedAbsorbers_244_129.pdf DCON26_SLIDES_Track10_BridgingtheTime-FrequencyChasminPDNDesignLeveragingCumulativePower-railNoiseReversePu_206_135.pdf DCON26_SLIDES_Track09_PAMXmYModulationProposalfor448G_89_171.pdf DCON26_SLIDES_Track08_JitterDecompositionMethodology4-PhaseSkewCharacterizationforHigh-SpeedDRAMInterfaces_76_142.pdf DCON26_SLIDES_Track09_TutorialPAM6SignalingAProspectiveCandidatefor448GbpsperLane_37_204.pdf DCON26_SLIDES_Track8_AWG-AssistedLowNoisePhysicalChannelDigitalizationfor112GbpsPAM4ITOLJOTLVerification_126_122.pdf DCON26_SLIDES_Track07_PCBViaPlate-ModeLossInfluenceofViaDesignParameters_73_154.pdf DCON26_SLIDES_Track13_ImpactAnalysisofPackageManufacturingProcessVariationsAcrossDifferentDesignScenarios_164_111.pdf DCON26_SLIDES_Track12_MetrologyStatisticalProcessControlTechniquesfor224G448GSkewManagement_129_160.pdf DCON26_SLIDES_Track12_ManualMicro-probesforOne-PortPCBCharacterizationwithaSingleTouchdown_234_197.pdf DCON26_SLIDES_Track07_CrosstalkSensitivityNewFindingonPCIe7.0ChannelThroughS-ParameterManipulation_256_151.pdf DCON26_SLIDES_Track11_Tutorial朇haracterizingDebuggingtheTopThreeEMCIssuesRadiatedEmissionsRadiatedImmunity_134_131.pdf DCON26_SLIDES_Track06_Tutorial_ESDProtectionforModernHigh-SpeedInterfaces_173_107.pdf DCON26_SLIDES_Track10_StabilityMore朑oingBeyondBodeStabilityAssessment_265_138.pdf DCON26_SLIDES_Track10_ModelingMeasuringLargeSignalPDNCrosstalkGroundBouncewithaMulti-PhaseVRMSystemUsingaFa_105_136.pdf DCON26_SLIDES_Track14_HolisticDesignOptimizationof3D-ICPackageSubstrateInterconnectionsinMultiplePowerDomai_197_108.pdf DCON26_SLIDES_Track09_AnalysisofHigh-OrderPulseAmplitudeModulationfor400GbsperlaneinEthernetforAI_31_184.pdf DCON26_SLIDES_Track06_APerformanceEvaluationMethodofElectrical-OpticalChannelCouplingfor112G224GLPORTLRBase_114_124.pdf DCON26_SLIDES_Track09_SEMIMOSignalingCanitSave400G_84_140.pdf DCON26_SLIDES_Track13_AcceleratingHigh-SpeedConnectorBreakoutwithPredictiveMachineLearningPhysics-GuidedIns_46_89.pdf DCON26_SLIDES_Track07_Tutorial朎nabling224G448GCo-PackagedCopperArchitectures_252_155.pdf DCON26_SLIDES_Track04_MethodstoModelMeasureNoiseMitigationwithEmbeddedCapacitorsinHigh-CurrentPDNsforAIClou_107_200.pdf DCON26_SLIDES_Track08_OIFCEI-PAM456Gto224GErrorBurstsSpecificationsContiguousSequenceorNot_71_144.pdf DCON26_SLIDES_Track12_NavigatingtheNewFrontierAGuidetoTestingSiliconPhotonicsHigh-SpeedLinks_179_222.pdf DCON26_SLIDES_Track03_Panel朇POvs.OIOEvolutionorRevolutioninOptical_149_223.pdf DCON26_SLIDES_Track07_ReinventingtheBackplaneWhyAIDemandsanActiveApproach_210_148.pdf DCON26_SLIDES_Track12_AnExperimentalStudyofPCIeTransmitterEqualizationPresetMeasurementMethodsfor64and128GT_274_121.pdf DCON26_SLIDES_Track03_448GbpsChallengesforScale-UpScale-OutApplications_35_99.pdf DCON26_SLIDES_Track07_AdvancingSignalIntegrityforHigh-SpeedSerDesFromPackage-BoardConstraintstoOn-PackageIn_188_156.pdf DCON26_SLIDES_Track07_Evaluationof224G-PAM4Co-PackagedCopperInterconnectsforNext-GenerationEthernet_101_225.pdf DCON26_SLIDES_Track05_PhotonicFabricMemoryLinkforAcceleratedComputing_42_106.pdf DCON26_SLIDES_Track11_AHybridSystem-LevelModelingandSensitivityAnalysisApproachtoImproveICImmunityforInduct_269_130.pdf DCON26_SLIDES_Track07_400GChannelsforAIApplicationsPassiveActiveCopperCableAssembliestoEnableScaleUpScaleOu_212_181.pdf DCON26_SLIDES_Track01_PracticalModelingof3DInterconnectswithHatchedGroundPlanesinSiliconInterposersBridgesF_140_87.pdf DCON26_SLIDES_Track03_DemonstrationofanElectronic-PhotonicCo-DesignCo-SimulationFlowforHigh-SpeedOpticalCom_99_97.pdf DCON26_SLIDES_Track01_448GPackageInterconnectsDesign_285_167.pdf DCON26_SLIDES_Track06_FastSignalIntegritySimulationOptimizationforLPDDR5xat10.7GbpsinAIPC_79_127.pdf DCON26_SLIDES_Track10_AI-DrivenEmulationofPowerSupplyRippleviaHSSJitterAnalysisTIE-BasedSourceIsolationforP_263_182.pdf DCON26_SLIDES_Track01_BeyondOff-chipBandwidthLimitsPI-awareExtendedScaleCacheESCStacked-GPU-HBMModuleforTra_65_93.pdf DCON26_SLIDES_Track05_EnablingHigh-SpeedDie-to-DieInterfaceswithWallstripAStudyonInsertionLossCrosstalkMetr_68_105.pdf DCON26_SLIDES_Track09_OIF448GbpsElectricalSignalingforAIProgress224GbpsUpdateforCEIOn-goingDevelopments_38_212.pdf DCON26_SLIDES_Track04_AnImprovedBroadbandMaterialCharacterizationMethod_49_101.pdf DCON26_PAPER_Track14_HolisticDesignOptimizationof3D-ICPackageSubstrateInterconnectionsinMultiplePowerDomain_197_56.pdf DCON26_SLIDES_Track08_PCIeBackchannelOptimizationFFESamplingSetupTuningforEnhancedEDPerformancewithCompleme_247_146.pdf DCON26_PAPER_Track13_ViaFan-OutDesignsfor448GbpsSIvsTechnology_109_70.pdf DCON26_SLIDES_Track11_CharacterizationandSuppressionofRFICausedbyLPCAMM2StructuralResonanceinCompactLaptops_82_132.pdf DCON26_SLIDES_Track03_448GIsCopperStillaViableSolutionforIn-chassisConnections_241_206.pdf DCON26_PAPER_Track13_PCBViaPlate-ModeLossInfluenceofViaDesignParameters_73_69.pdf DCON26_SLIDES_Track10_ANovelOff-BoardVerticalPowerSupplySolution_121_134.pdf DCON26_SLIDES_Track02_AnalyzingModelingJitter-InducedCrosstalkAmplificationforHigh-SpeedMemorySystems_113_95.pdf DCON26_SLIDES_Track07_Tutorial朥nderstandingtheViterbiDecoder_25_147.pdf DCON26_PDFPanel朠oweringtheFutureAIsRoleinNext-GenerationPowerIntegritySolutionsBroadAspirational_127_177.pdf DCON26_SLIDES_Track07_NextGeneration448GbpsSERDESPackageLongReachChannelsEnd-to-EndLinkSimulationAnalysis_172_157.pdf DCON26_SLIDES_Track09_PAM6vs.PAM8朼FewConsiderationsMore卂85_168.pdf DCON26_SLIDES_Track07_BreakingBarriersin448GbpsSerialLinksBandwidthESDLinearityChallengesinHigh-OrderPAMSys_137_149.pdf DCON26_SLIDES_Track06_IBIS-AMIModelingforBi-directionalD2DLinksWithClockForwardingEchoCancellation_139_185.pdf DCON26_SLIDES_Track08_Tutorial朌esignVerificationforHigh-SpeedIOsat10to112224Gbps448GbpswithJitterSignalInt_221_228.pdf DCON26_SLIDES_Track06_AnalyticalDerivationofPNSkewsinCoupledChannelsImpacton400GPAM6SerDes_50_109.pdf DCON26_SLIDES_Track08_ImprovingSpectralEfficiencybyOptimizingSub-NyquistEqualizationfor448Gbps_125_143.pdf DCON26_SLIDES_Track07_Panel朤heCaseoftheClosingEyes200GLane400GLaneAIHardwareHavetheopticsalreadywonTheImpa_45_194.pdf DCON26_SLIDES_Track03_EnergyEfficiencyinAIApplications朚akingSenseoftheMultipleRequirements_21_193.pdf DCON26_SLIDES_Track07_BreakthroughsinPCBTechnologyforPCIe7.0Interconnects_171_150.pdf DCON26_SLIDES_Track01_DistributedCapacitorCharacterizationforAdvancedPackaging_143_86.pdf DCON26_SLIDES_Track06_TopSideInterconnectEnablingforPCIe7.0Beyond_279_119.pdf DCON26_SLIDES_Track06_ANovelElectricalLoopbackApproachfor224GLaneNetworking1.6TIOPortsPerformanceValidation_48_227.pdf DCON26_SLIDES_Track04_FromCopperSurfaceMicroroughnesstotheFullTransmissionLineAComprehensiveMultiscaleModel_18_104.pdf DCON26_SLIDES_Track03_OptimizingHostOutputTP1aEqualizationSignalTuningforLinearOpticalLinksin106112GbLinear_191_100.pdf DCON26_SLIDES_Track08_PAM4MeasurementsThroughLossyChannels朩hyOscilloscopeCDREmulationMatters_270_145.pdf DCON26_SLIDES_Track07_NewTechniqueforCrosstalkReductioninHigh-DensityPCBs_19_153.pdf DCON26_SLIDES_Track06_HowZeroBiasDiscreteTLVRMaximizesRevenueonProductBoards_33_112.pdf DCON26_PAPER_Track12_ManualMicro-probesforOne-PortPCBCharacterizationwithaSingleTouchdown_234_72.pdf DCON26_SLIDES_Track01_Adv.SoCICPackagingArchitecture_309_90.pdf DCON26_SLIDES_Track04_BeyondRoughnessMeasurementANovelMethodforHigh-FrequencyElectricalCharacterizationofCo_64_103.pdf DCON26_SLIDES_Track02_ModelingStudyofPowerSupplyNoisePSNinServerDDRLinks_184_96.pdf DCON26_PAPER_Track13_PortReferencinginS-ParametersCriticalInsightsYouNeedtoKnow_213_71.pdf DCON26_SLDIES_Track01_SuperchargingSoCPowerIntegritywithSiliconCapacitors_47_91.pdf DCON26_PAPER_Track13_BreakingtheBandwidthBarrierTestFixturesandMethodologiesfor448GbpsDataTransmission_167_63.pdf DCON26_PAPER_Track13_ImpactAnalysisofPackageManufacturingProcessVariationsAcrossDifferentDesignScenarios_164_65.pdf DCON26_SLIDES_Track04_EnhancingLossPerformanceLinePrecisioninUHDIPCBsUsingAdvancedPackagingMaterialsIonBeam_104_169.pdf DCON26_SLIDES_DrivingTowardsaComplete448GEcosystem_310_201.pdf DCON26_PAPER_Track12_MetrologyStatisticalProcessControlTechniquesfor224G448GSkewManagement_129_189.pdf DCON26_PAPER_Track12_NavigatingtheNewFrontierAGuidetoTestingSiliconPhotonicsHigh-SpeedLinks_179_166.pdf DCON26_PAPER_Track14_AcceleratingHigh-SpeedConnectorBreakoutwithPredictiveMachineLearningPhysics-GuidedInsi_46_52.pdf DCON26_SLIDES_Track01_IBIS-AMIModellingMethodologyforSimultaneousBi-DirectionalSBDDie-to-DieChipletConnecti_214_170.pdf DCON26_PAPER_Track12_AI-DrivenEmulationofPowerSupplyRippleviaHSSJitterAnalysisTIE-BasedSourceIsolationforPI_263_75.pdf DCON26_PAPER_Track12_AnExperimentalStudyofPCIeTransmitterEqualizationPresetMeasurementMethodsfor64and128GTs_274_77.pdf DCON26_SLIDES_LessonsLearnedat224Gbps_293_203.pdf DCON26_PAPER_Track13_MultimodeResonanceSuppressionPAM4EyeDecompositionfor212.5-GbpsOSFP_88_67.pdf DCON26_PAPER_Track10_ModelingMeasuringLargeSignalPDNCrosstalkGroundBouncewithaMulti-PhaseVRMSystemUsingaFas_105_224.pdf DCON26_PAPER_Track11_AHybridSystem-LevelModelingandSensitivityAnalysisApproachtoImproveICImmunityforInducti_269_76.pdf DCON26_PAPER_Track14_FastPDNImpedanceMatrixPredictionforPCBDesignUtilizingLatentSpaceEmbedding_83_55.pdf DCON26_PAPER_Track12_PerformanceCriteriaPracticalImplementationofDe-embeddingTestFixturesfor200GbsPerLaneCo_189_79.pdf DCON26_PAPER_Track08_PCIeBackchannelOptimizationFFESamplingSetupTuningforEnhancedEDPerformancewithComplemen_247_44.pdf DCON26_PAPER_Track12_BridgingtheGapBetweenSimulationMeasurementinDDR5TechniquesforImprovedCorrelation_182_85.pdf DCON26_PAPER_Track13_Near-ChipCopackagedCopperCopackagedOpticsInterconnects_58_164.pdf DCON26_PAPER_Track07_BreakingBarriersin448GbpsSerialLinks_137_33.pdf DCON26_PAPER_Track12_PracticalSemi-AutomatedApproachforSignalIntegrityTestingofHigh-SpeedHigh-DensityCableH_183_83.pdf DCON26_PAPER_Track11_CharacterizationandSuppressionofRFICausedbyLPCAMM2StructuralResonanceinCompactLaptops_82_78.pdf DCON26_PAPER_Track05_EnablingHigh-SpeedDie-to-DieInterfaceswithWallstripAStudyonInsertionLossCrosstalkMetri_68_22.pdf DCON26_PAPER_Track10_ANovelOff-BoardVerticalPowerSupplySolution_121_60.pdf DCON26_PAPER_Track09_AnalysisofHigh-OrderPulseAmplitudeModulationfor400GbsperlaneinEthernetforAI_31_46.pdf DCON26_PAPER_Track03_448GbpsChallengesforScale-UpScale-OutApplications_35_12.pdf DCON26_PAPER_Track08_JitterDecompositionMethodology4-PhaseSkewCharacterizationforHigh-SpeedDRAMInterfaces_76_43.pdf DCON26_PAPER_Track07_NewTechniqueforCrosstalkReductioninHigh-DensityPCBs_19_32.pdf DCON26_PAPER_Track06_TopSideInterconnectEnablingforPCIe7.0Beyond_279_205.pdf DCON26_PAPER_Track06_AComprehensiveElectricalLoopbackApproachfor224GLaneNetworking1.6TIOPortsPerformanceVal_48_24.pdf DCON26_PAPER_Track04_FromCopperSurfaceMicroroughnesstotheFullTransmissionLineAComprehensiveMultiscaleModeli_18_20.pdf DCON26_PAPER_Track12_UncertaintyLoomsLargeImprovingtheAccuracyofStepLoadTesting_54_84.pdf DCON26_PAPER_Track12_AdaptiveScopeNoiseRemovalAPracticalTrade-OffBetweenMeasurementBiasandVariation_90_80.pdf DCON26_PAPER_Track10_HowZeroBiasDiscreteTLVRMaximizesRevenueonProductBoards_33_66.pdf DCON26_PAPER_Track09_PAM6vs.PAM8朼FewConsiderationsMore卂85_51.pdf DCON26_PAPER_Track08_PAM4MeasurementsThroughLossyChannels朩hyOscilloscopeCDREmulationMatters_270_41.pdf DCON26_PAPER_Track07_ReinventingtheBackplaneWhyAIDemandsanActiveApproach_210_30.pdf DCON26_PAPER_Track07_AdvancingSignalIntegrityforHigh-SpeedSerDesFromPackage-BoardConstraintstoOn-PackageInt_188_38.pdf DCON26_PAPER_Track06_APerformanceEvaluationMethodofElectrical-OpticalChannelCouplingfor112G224GLPORTLRBased_114_29.pdf DCON26_PAPER_Track05_BeyondOff-chipBandwidthLimitsPI-awareExtendedScaleCacheESCStacked-GPU-HBMModuleforTran_65_21.pdf DCON26_PAPER_Track09_AdaptiveSerDesPowerScalingforSystemEnergyEfficiencyOptimization_63_45.pdf DCON26_PAPER_Track04_BeyondRoughnessMeasurementANovelMethodforHigh-FrequencyElectricalCharacterizationofCop_64_19.pdf DCON26_PAPER_Track01_SuperchargingSoCPowerIntegritywithSiliconCapacitors_47_8.pdf DCON26_PAPER_Track07_CrosstalkSensitivityNewFindingonPCIe7.0ChannelThroughS-ParameterManipulation_256_34.pdf DCON26_PAPER_Track12_Connector-FreeTerminationforFEXTMeasurementsUsingAbsorbersonBGAPads_233_81.pdf DCON26_PAPER_Track01_448GPackageInterconnectsDesign_285_4.pdf DCON26_PAPER_Track09_SEMIMOSignalingCanitSave400G_84_50.pdf DCON26_PAPER_Track11_TargetedEMIMitigationUsingEmissionSourceImaging3D-PrintedAbsorbers_244_74.pdf DCON26_PAPER_Track08_ImprovingSpectralEfficiencybyOptimizingSub-NyquistEqualizationfor448Gbps_125_39.pdf DCON26_PAPER_Track09_PAMXmYModulationProposalfor448G_89_53.pdf DCON26_PAPER_Track10_BridgingtheTime-FrequencyChasminPDNDesign_206_62.pdf DCON26_PAPER_Track06_LinkDynamicModelingSimulationUsingIBIS-AMIFramework_69_28.pdf DCON26_PAPER_Track09_ModelingTransmitterwithBoostingCapacitorbasedonPlugged-inBehaviorIBIS_166_48.pdf DCON26_PAPER_Track08_AWG-AssistedLowNoisePhysicalChannelDigitalizationfor112GbpsPAM4ITOLJOTLVerification_126_42.pdf DCON26_PAPER_Track05_PhotonicFabricMemoryLinkforAcceleratedComputing_42_23.pdf DCON26_PAPER_Track08_OIFCEI-PAM456Gto224GErrorBurstsSpecificationsContiguousSequenceorNot_71_40.pdf DCON26_PAPER_Track06_IBIS-AMIModelingforBi-directionalD2DLinksWithClockForwardingEchoCancellation_139_27.pdf DCON26_PAPER_Track07_NextGeneration448GbpsSERDESPackageLongReachChannelsEnd-to-EndLinkSimulationAnalysis_172_35.pdf DCON26_PAPER_Track04_EnhancingLossPerformanceLinePrecisioninUHDIPCBsUsingAdvancedPackagingMaterialsIonBeamT_104_186.pdf DCON26_PAPER_Track07_400GChannelsforAIApplicationsPassiveActiveCopperCableAssembliestoEnableScaleUpScaleOut_212_31.pdf DCON26_PAPER_Track04_BreakthroughsinPCBTechnologyforPCIe7.0Interconnects_171_18.pdf DCON26_PAPER_Track03_DemonstrationofanElectronic-PhotonicCo-DesignCo-SimulationFlowforHigh-SpeedOpticalComm_99_13.pdf DCON26_PAPER_Track02_AnalyzingModelingJitter-InducedCrosstalkAmplificationforHigh-SpeedMemorySystems_113_11.pdf DCON26_PAPER_Track06_AnalyticalDerivationofPNSkewsinCoupledChannelsImpacton400GPAM6SerDes_50_25.pdf DCON26_PAPER_Track02_ModelingStudyofPowerSupplyNoisePSNinServerDDRLinks_184_10.pdf DCON26_PAPER_Track03_OptimizingHostOutputTP1aEqualizationSignalTuningforLinearOpticalLinksin106112GbLinearP_191_14.pdf DCON26_PAPER_Track01_Adv.SoCICPackagingArchitecture_309_163.pdf DCON26_PAPER_Track04_MethodstoModelMeasureNoiseMitigationwithEmbeddedCapacitorsinHigh-CurrentPDNsforAICloud_107_16.pdf DCON26_PAPER_Track01_DistributedCapacitorCharacterizationforAdvancedPackaging_143_3.pdf DCON26_PAPER_Track02_Scalingto100TbsSwitchesUsingCo-PackagedConnectors_277_9.pdf DCON26_PAPER_Track04_AnImprovedBroadbandMaterialCharacterizationMethod_49_17.pdf DCON26_PAPER_Track01_IBIS-AMIModellingMethodologyforSimultaneousBi-DirectionalSBDDie-to-DieChipletConnectiv_214_6.pdf DCON26_PAPER_Track01_PracticalModelingof3DInterconnectswithHatchedGroundPlanesinSiliconInterposersBridgesFl_140_7.pdf

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